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cy7c68300 a cypress semiconductor corporation ? 3901 north first street san jose , ca 95134 408-943-2600 document #: 38-08031 rev. *b revised august 15, 2003 ez-usb at2? usb 2.0 to ata/atapi bridge
cy7c68300 a document #: 38-08031 rev. *b page 2 of 26 table of contents 1.0 introduction .............................................................................................................. ................ 4 1.1 features .................................................................................................................. .................... 4 2.0 pin assignments ........................................................................................................... ............. 6 2.1 pin diagram ............................................................................................................... ................. 6 2.2 pin descriptions .......................................................................................................... ................ 8 2.3 additional pin descriptions ............................................................................................... .......... 9 2.3.1 dplus, dminus ........................................................................................................... ................... 9 2.3.2 scl, sda ................................................................................................................ .......................... 9 2.3.3 xtalin, xtalout ......................................................................................................... .................. 9 2.3.4 ata_en .................................................................................................................. ........................10 2.3.5 ata interface pins ...................................................................................................... .................... 10 2.3.6 vbus_pwr_valid .......................................................................................................... ..............10 2.3.7 reset# .................................................................................................................. ........................10 3.0 applications .............................................................................................................. ............... 11 3.1 additional resources ...................................................................................................... .......... 11 4.0 functional overview ....................................................................................................... ..... 11 4.1 usb signaling speed ....................................................................................................... ........ 11 4.2 ata interface ............................................................................................................. ............... 11 5.0 enumeration ............................................................................................................... .............. 11 5.1 board manufacturing test mode ............................................................................................. .. 11 5.1.1 cfgcb ................................................................................................................... ........................... 11 5.1.2 mfgcb ................................................................................................................... .......................... 12 5.2 normal operation mode ..................................................................................................... ....... 13 5.3 eeprom organization ....................................................................................................... ...... 13 6.0 absolute maximum ratings ................................................................................................ 22 7.0 operating conditions [6] ........................................................................................................................... ........................................22 8.0 dc characteristics ........................................................................................................ ....... 22 9.0 ac electrical characteristics ....................................................................................... 22 9.1 usb transceiver ........................................................................................................... ............ 22 9.2 ata timing ................................................................................................................ ............... 22 10.0 ordering information ..................................................................................................... ... 23 11.0 package diagrams ........................................................................................................ ...... 23 12.0 pcb layout recommendations ........................................................................................ 24 13.0 quad flat package no leads (qfn) package design notes ................................ 24 14.0 other design considerations ......................................................................................... 25 14.1 proper power-up sequence ................................................................................................. ... 25 14.2 ide removable media devices .............................................................................................. 25 14.3 devices with small buffers ............................................................................................... ...... 25 15.0 disclaimers, trademarks, and copyrights ............................................................... 25
cy7c68300 a document #: 38-08031 rev. *b page 3 of 26 list of figures figure 1-1. block diagram ...................................................................................................... ................. 5 figure 2-1. 56-pin ssop ........................................................................................................ ................. 6 figure 2-2. 56-pin qfn ......................................................................................................... ................... 7 figure 2-3. xtalin, xtalout diagram............................................................................................ ... 10 figure 2-4. typical reset circuit .............................................................................................. ............. 10 figure 11-1. 56-lead shrunk small outline package 056...................................................................... 23 figure 11-2. 56-lead quad flatpack no lead (8 x 8 mm) lf56 ............................................................ 23 figure 13-1. cross-section of the area underneath the qfn package................................................ 24 figure 13-2. plot of the solder mask (white area) .............................................................................. .. 25 figure 13-3. x-ray image of the assembly ....................................................................................... ..... 25 list of tables table 5-1. command block wrapper .............................................................................................. ..... 12 table 5-2. example cfgcb ...................................................................................................... ............. 12 table 5-3. example mfgcb ...................................................................................................... ............. 12 table 5-4. mfg_load data format ............................................................................................... .......... 12 table 5-5. mfg_read data format ............................................................................................... ......... 13 table 5-6. eeprom organization ................................................................................................ ........ 14
cy7c68300 a document #: 38-08031 rev. *b page 4 of 26 1.0 introduction the cy7c68300a implements a fixed-function bridge between one usb port and one ata- or atapi-based mass storage device port. this bridge adheres to the mass storage class bulk-only transport specification and is intended for self-powered devices. the usb port of the cy7c68300a is connected to a host computer directly or via the downstream port of a usb hub. host software issues commands and data to the cy7c68300a and receives status and data from the cy7c68300a using standard usb protocol. the ata/atapi port of the cy7c68300a is connected to a mass storage device. a 4-kbyte buffer maximizes ata/atapi data transfer rates by minimizing losses due to device seek times. the ata interface supports ata pio modes 0, 3, and 4, and ultra dma modes 2 and 4. the device initialization process is configurable, enabling the cy7c68300a to initialize ata/atapi devices without software intervention. 1.1 features complies with usb-if specifications for usb 2.0, the usb mass storage class , and the usb mass storage class bulk-only transport specification operates at high (480-mbps) or full (12-mbps) speed complies with t13?s ata/atapi-6 draft specification supports 48-bit addressing for large hard drives supports pio modes 0, 3, 4, and udma modes 2, 4 uses one external serial eeprom containing the usb device serial number, vendor and product identification data, and device configuration data ata interface irq signal support support for a single ata/atapi device configured either as master or slave ?ata-enable? input signal, which three-states all signals on the ata interface in order to allow sharing of the bus with another controller (e.g., an ieee-1394 to ata bridge chip) support for board-level manufacturing test via usb interface 3.3v operation for self-powered devices 56-pin ssop and 56-pin qfn packages .
cy7c68300 a document #: 38-08031 rev. *b page 5 of 26 usb 2.0 xcvr cy smart usb fs/hs engine 4kby te fifo pll i2c-compatible bus controller ata interface logic data control 24 mh z xta l 16 bit ata data a t a _ e n ( a t a i n t e r f a c e 3 - s t a t e ) vbus d+ d- at2 internal logic r e s e t scl sda ata interf ace control signals figure 1-1. block diagram
cy7c68300 a document #: 38-08031 rev. *b page 6 of 26 2.0 pin assignments 2.1 pin diagram figure 2-1. 56-pin ssop 24 23 20 21 22 19 18 17 14 15 16 13 12 11 8 9 10 7 6 5 2 3 4 1 26 28 25 27 33 34 37 36 35 38 39 40 43 42 41 44 45 46 49 48 47 50 51 52 55 54 53 56 31 29 32 30 dd3 dd2 dd1 dd0 vcc sda scl reserved pu10k gnd vcc gnd dd4 dd5 dd6 dd7 gnd vcc gnd diow# dior# dmack# vcc intrq dminus dplus vcc agnd da0 da1 da2 cs0# xtalin xtalout avcc dmarq cs1# vbus_pwr_valid areset# gnd iordy gnd vcc nc reset# vcc ata_en dd8 gnd dd15 dd14 dd13 dd9 dd10 dd11 dd12 ez-usb at2 cy7c68300a 56-pin ssop
cy7c68300 a document #: 38-08031 rev. *b page 7 of 26 figure 2-2. 56-pin qfn ez-usb at2 cy7c68300a 56-pin qfn reset# gnd areset# vbus_pwr_valid cs1# cs0# da2 da1 da0 intrq vcc dmack# dior# diow# iordy dmarq avcc xtalout xtalin agnd vcc dplus dminus gnd vcc gnd pu10k reserved gnd vcc nc gnd dd15 dd14 dd13 dd12 dd11 dd10 dd9 dd8 ata_en vcc scl sda vcc dd0 dd1 dd2 dd3 dd4 dd5 dd6 dd7 gnd vcc gnd 1 2 3 4 5 6 7 8 9 10 11 12 13 14 42 41 40 39 38 37 36 35 34 33 32 31 30 29 56 55 54 53 52 51 50 49 48 47 46 45 44 43 28 27 26 25 24 23 22 21 20 19 18 17 16 15
cy7c68300 a document #: 38-08031 rev. *b page 8 of 26 2.2 pin descriptions ssop pin qfn pin pin name pin type default state at start-up pin description 1 50 dd13 i/o [1] hi-z ata data bit 13 . 2 51 dd14 i/o [1] hi-z ata data bit 14 . 3 52 dd15 i/o [1] hi-z ata data bit 15 . 4 53 gnd gnd ground . 5 54 nc hi-z reserved . this pin should remain a no-connect. 6 55 v cc pwr v cc . connect to 3.3v power source. 7 56 gnd gnd ground . 8 1 iordy i [1] i ata control . 9 2 dmarq i [1] i ata control . 10 3 av cc pwr analog v cc . connect the v cc through the shortest path possible. 11 4 xtalout xtal xtal 24-mhz crystal output (see section 2.3.3). 12 5 xtalin xtal xtal 24-mhz crystal input (see section 2.3.3). 13 6 agnd gnd analog ground . connect to ground with as short a path as possible. 14 7 v cc pwr v cc . connect to 3.3v power source. 15 8 dplus i/o pulled high when reset is active. when reset is released, the pull-up is controlled by pin 46(ssop)/ 39(qfn). when vbus_ pwr_valid is high, the line is pulled up. vbus_pwr _valid is polled at start-up and then every 20 ms. usb d+ signal (see section 2.3.1). 16 9 dminus i/o hi-z usb d- signal (see section 2.3.1). 17 10 gnd gnd ground . 18 11 v cc pwr v cc . connect to 3.3v power source. 19 12 gnd gnd ground . 20 13 pu10k hi-z tied to 10k 5% pull-up resistor . 21 14 reserved reserved . tie to gnd. 22 15 scl o scl/sda will be active for several ms at start-up. then driven high. clock signal for i 2 c-compatible interface (see section 2.3.2). 23 16 sda i/o data signal for i 2 c-compatible interface (see section 2.3.2). 24 17 v cc pwr v cc . connect to 3.3v power source. 25 18 dd0 i/o hi-z ata data bit 0 . 26 19 dd1 i/o hi-z ata data bit 1 . 27 20 dd2 i/o hi-z ata data bit 2 . 28 21 dd3 i/o hi-z ata data bit 3 . 29 22 dd4 i/o hi-z ata data bit 4 . 30 23 dd5 i/o hi-z ata data bit 5 . 31 24 dd6 i/o hi-z ata data bit 6 . 32 25 dd7 i/o hi-z ata data bit 7 . 33 26 gnd gnd ground . 34 27 v cc pwr v cc . connect to 3.3v power source. note: 1. ata interface pins are not active when ata_en is not asserted.
cy7c68300 a document #: 38-08031 rev. *b page 9 of 26 2.3 additional pin descriptions 2.3.1 dplus, dminus dplus and dminus are the usb signaling pins, and they should be tied to the d+ and d? pins of the usb connector. because they operate at high frequencies, the usb signals require special consideration when designing the layout of the pcb. 2.3.2 scl, sda the clock and data pins for the i 2 c-compatible port should be connected to your configuration eeprom and to v cc through 2.2k resistors. 2.3.3 xtalin, xtalout the cy7c68300a requires a 24-mhz signal to derive internal timing. typically a 24-mhz parallel-resonant fundamental mode crystal is used, but a 24-mhz square wave from another source can also be used. if a crystal is used, connect the pins to xtali n and xtalout, and also through 20-pf capacitors to gnd. if an alternate clock source is used, apply it to xtalin and leave xtalout open. note: 2. a # sign after the signal name indica tes that it is an active low signal. 35 28 gnd gnd ground . 36 29 diow# [2] o/z [1] driven high (cmos) ata control . 37 30 dior# o/z [1] driven high (cmos) ata control . 38 31 dmack# o/z [1] driven high (cmos) ata control . 39 32 v cc pwr v cc . connect to 3.3v power source. 40 33 intrq i [1] input ide ata interrupt request . 41 34 da0 o/z [1] driven high after 2 ms delay ata address . 42 35 da1 o/z [1] driven high after 2 ms delay ata address . 43 36 da2 o/z [1] driven high after 2 ms delay ata address . 44 37 cs0# o/z [1] driven high after 2 ms delay ata chip select . 45 38 cs1# o/z [1] driven high after 2 ms delay ata chip select . 46 39 vbus_pw r_valid i input vbus detection . indicates to the cy7c68300a that vbus power is present. 47 40 areset# o/z [1] ata reset . 48 41 gnd gnd ground . 49 42 reset# i active low reset . resets the entire chip. this pin is normally tied to vcc through a 100k resistor, and to gnd through a 0.1-f capacitor, supplying a 10-ms reset. 50 43 v cc pwr v cc . connect to 3.3v power source. 51 44 ata_en i input ? if cy7c68300a is not in mfg mode, polled every 20 ms after start-up. if low, ssop pins 36?38, 41?45 and 47 or qfn pins 29?31, 34?38 and 40 are three- stated. active high . ata interface enable. allows ata bus sharing with other host devices. setting ata_en=1 enables the ata interface for normal operation. disabling ata_en three-states (high-z) the ata interface and halts the ata interface state machine logic. 52 45 dd8 i/o [1] hi-z ata data bit 8 . 53 46 dd9 i/o [1] hi-z ata data bit 9 . 54 47 dd10 i/o [1] hi-z ata data bit 10 . 55 48 dd11 i/o [1] hi-z ata data bit 11 . 56 49 dd12 i/o [1] hi-z ata data bit 12 . 2.2 pin descriptions (continued) ssop pin qfn pin pin name pin type default state at start-up pin description
cy7c68300 a document #: 38-08031 rev. *b page 10 of 26 2.3.4 ata_en ata_en allows bus sharing with other host devices. setting ata_en = 1 enables the ata interface for normal operation. setting ata_en = 0 disables (high-z) the ata interface pins and removes the cy7c68300a from the usb. because the cy7c68300a supports a true low-power usb suspend state, new functionality was added to ensure that transitions of the ata_en signal could be detected properly under all circumstances. the cy7c68300a will behave in the following manner: if ata_en transitions to '0' during normal operation, the cy7c68300a will disconnect from the usb and drop to a low-power mode. if ata_en transitions to '1' when in low-power mode and no other condition is causing the low-power state, the cy7c68300a will return to a post-reset state and reconnect to the usb. if the cy7c68300a is already in suspend and ata_en transitions to '0', the cy7c68300a will resume only long enough to stop driving the ata interface (high-z) and drop back to low-power again. if the cy7c68300a is already in suspend and ata_en transitions to '1', the cy7c68300a will resume only long enough to start driving the ata interface and drop to low-power again. the ata_en pin is sampled at a rate of 50 times per second by the cy7c68300a internal logic. this pin should be set to a high at start-up. note that disabling the ata bus with the ata_en pin during the middle of a data transfer will result in data loss and can cause the operating system on the host computer to crash. 2.3.5 ata interface pins if a cable is used to connect the cy7c68300a to a udma device, the cable must be an 80-pin cable as shown in the ata-6 spec, annex a. 2.3.6 vbus_pwr_valid vbus_pwr_valid indicates to the cy7c68300a that power is present on vbus. this pin is polled by the cy7c68300a at start-up and then every 20ms thereafter. if this pin is ?1?, the 1.5k pull-up is attached to d+. if this pin is ?0?, the cy7c68 300a will release the pullup on d+ as required by the usb specification. 2.3.7 reset# asserting reset# for 10 ms will reset the entire chip. this pin is normally tied to v cc through a 100k resistor, and to gnd through a 0.1- f capacitor. figure 2-4. typical reset circuit 24mhz crystal 20pf 20pf figure 2-3. xtalin, xtalout diagram c1 0.1 ufd nreset r8 100k
cy7c68300 a document #: 38-08031 rev. *b page 11 of 26 3.0 applications the cy7c68300a is a high-speed usb 2.0 peripheral device that connects a single ata or atapi storage device to a usb host using the usb mass storage class protocol. 3.1 additional resources cy4615 ez-usb at2 reference design kit usb specification version 2.0 ata specification t13/1410d rev 3b usb mass storage class bulk only transport specification , http://www.usb.org/developers/data/devclass/ usbmassbulk_10.pdf. 4.0 functional overview 4.1 usb signaling speed cy7c68300a operates at two of the three rates defined in the usb specification revision 2.0 dated april 27, 2000: full speed, with a signaling bit rate of 12 mbits/sec high speed, with a signaling bit rate of 480 mbits/sec. cy7c68300a does not support the low-speed signaling rate of 1.5 mbits/sec. 4.2 ata interface the ata/atapi port on the cy7c68300a is compliant with the information technology at attachment with packet interface 6 (ata/atapi-6) specification, t13/1410d rev 3b. the cy7c68300a supports atapi packet commands over usb. additionally, the cy7c68300a translates atapi sff-8070i commands to ata commands for seamless integration of ata devices with generic mass storage class bulk only transport drivers. 5.0 enumeration during the power-up sequence, internal logic checks the i 2 c-compatible port for an eeprom whose first two bytes are both 0x4d. if a valid signature is found, the cy7c68300a uses the values stored in the eeprom to configure the usb descriptors for normal operation. if an invalid eeprom signature is read, or if no eeprom is detected, the cy7c68300a defaults into board manufacturing test mode. the two modes of operation are described in subsections 5.1 and 5.2, below. 5.1 board manufacturing test mode in board manufacturing test mode, the chip behaves as a usb 2.0 device but the ata/atapi interface is not active. the cy7c68300a allows for reading and writing an eeprom and for board level testing through vendor specific atapi commands utilizing the cbw command block as described in the usb mass storage class bulk-only transport specification . there is a vendor-specific atapi command for the eeprom access (cfgcb) and one for the board level testing (mfgcb). 5.1.1 cfgcb the cfg_load and cfg_read vendor-specific commands are passed down through the bulk pipe in the cbwcb portion of the cbw. the format of this cfgcb is shown below. byte 0 will be a vendor-specific command designator whose value is configurable and set in the configuration data (eeprom address 0x04). byte 1 must be set to 0x26 to identify cfgcb. byte 2 is reserved and must be set to zero. byte 3 is used to determine the memory source to write/read. for the cy7c68300a, this byte must be set to 0x02, meaning the eeprom. bytes 4 and 5 will be used to determine the start address. for the cy7c68300a, this must always be 0x0000. bytes 6 through 15 are reserved and should be set to zero. the data transferred to the eeprom must be in the format specified in table 5-6 of this data sheet. maximum data transfer size is 255 bytes. the data transfer length is determined by the cbw data transfer length specified in bytes 8 through 11 (dcbwdatatransfer- length) of the cbw. the type/direction of the command will be determined by the direction bit specified in byte 12, bit 7 (bmcb w- flags) of the cbw.
cy7c68300 a document #: 38-08031 rev. *b page 12 of 26 5.1.2 mfgcb the mfg_load and mfg_read vendor-specific commands will be passed down through the bulk pipe in the cbwcb portion of the cbw. the format of this mfgcb is shown below. byte 0 is a vendor-specific command designator whose value is configurable and set in the configuration data. byte 1 must be 0x27 to identify mfgcb. byte 2?15 are reserved and must be set to zero. the data transfer length will be determined by the cbw data transfer length specified in bytes 8 through 11 (dcbwdatatrans- ferlength) of the cbw. the type/direction of the command is determined by the direction bit specified in byte 12, bit 7 (bmcbw- flags) of the cbw. 5.1.2.1 mfg_load during a mfg_load, the cy7c68300a goes into manufacturing test mode. manufacturing test mode is provided as a means to implement board or system level interconnect tests. during manufacturing test mode operation, all outputs not directly associat ed with usb operation are controllable. normal control of the output pins are disabled. control of the select cy7c68300a io pins and their three-state controls are mapped to the atapi data packet associated with this request. (see the following table for explanation of the required mfg_load data format.) this requires a write of seven bytes. to exit manufacturing test mode, a har d reset (#reset) is required. table 5-1. command block wrapper 7 6 54321 0 0?3 dcbwsignature 4?7 dcbwtag 8?11 (08h-0bh) dcbwdatatransferlength 12 (0ch) bwcbwflags dir obsolete reserved (0) 13 (0dh) reserved (0) bcbwlun 14 (0eh) reserved (0) bcbwcblength 15?30 (0fh1eh) cbwcb (cfgcb or mfgcb) table 5-2. example cfgcb cfgcb byte descriptions bits 76543210 0 bvscbsignature (set in configuration bytes) 00100100 1 bvscbsubcommand (must be 0x26) 00100110 2 reserved (must be set to zero) 00000000 3 data source (must be set to 0x02) 00000010 4 start address (lsb) (must be set to zero) 00000000 5 start address (msb) (must be set to zero) 00000000 6?15 reserved (must be set to zero) 00000000 table 5-3. example mfgcb mfgcb byte description bits 0 bvscbsignature (set in configuration bytes) 00100100 1 bvscbsubcommand (hardcoded 0x27) 00100111 2?15 reserved (must be zero) 00000000 table 5-4. mfg_load data format byte bit(s) test/three-state control function 00reserved 0 3:1 da[2:0] 0 5:4 cs#[1:0] 06reserved 0 7 areset# 1 0 ndiow
cy7c68300 a document #: 38-08031 rev. *b page 13 of 26 5.1.2.2 mfg_read this usb request returns a ?snapshot in time? of select cy7c68300a input pins. the input pin states are bit-wise mapped to the atapi data associated with this request. cy7c68300a input pins not directly associated with usb operation can be sampled at any time during manufacturing test mode operation. see the following table for an explanation of the mfg_read data format. the data length shall always be eight bytes. 5.2 normal operation mode in normal operation mode, the chip behaves as a usb 2.0 to ata/atapi bridge. this includes all typical usb device states (powered, configured, etc.). the usb descriptors are returned according to the values stored in the external eeprom. an external eeprom is required for mass storage class bulk-only tr ansport compliance, since a unique serial number is required for each device. also, cypress requires customers to use their own vendor and product ids for final products. 5.3 eeprom organization the contents of the 256-byte (2048-bit) two-wire serial eeprom are arranged as follows. the column labeled ?required contents? contains the values that must be used for proper operation of the cy7c68300a. the column labeled ?suggested contents? contains suggested values for the bytes that are defined by the manufacturer. some values, such as the vendor id and device and device serial number, must be customized to meet usb compliance. see section 5.1 for details on how to use vendor-specific atapi commands to read and program the eeprom. the serial eeprom must be hard-wired to address 0x04. this means that a0 and a1 of the serial eeprom must be tied to ground and that a2 must be tied to 3.3v. 1 1 ndior 1 2 ndmack 13:6reserved 1 7 dd[15:0] three-state (0 = three-state dd pins, 1 = enable dd pins). 2 7:0 dd[7:0] 3 7:0 dd[15:8] 47:0reserved 57:0reserved 67:0reserved table 5-5. mfg_read data format byte bit(s) test/three-state control function 00intrq 0 5:1 reserved. this data should be ignored. 0 6 vbus_pwr_valid 0 7 areset# (output value only) 1 2:0 reserved. this data should be ignored. 1 3 iordy 14dmarq 1 5 ata_en 1 6 reserved. this data should be ignored. 1 7 dd[15:0] three-state 2 7:0 dd[7:0] 3 7:0 dd[15:8] 4 7:0 reserved. this data should be ignored. 5 7:0 reserved. this data should be ignored. 6 7:0 reserved. this data should be ignored. 7 7:0 reserved. this data should be ignored. table 5-4. mfg_load data format (continued) byte bit(s) test/three-state control function
cy7c68300 a document #: 38-08031 rev. *b page 14 of 26 table 5-6. eeprom organization eeprom address field name field description required contents suggested contents configuration 0x00 i 2 c-compatible memory device signature (lsb) lsb i 2 c-compatible memory device signature byte. 0x4d 0x01 i 2 c-compatible memory device signature (msb) msb i 2 c-compatible memory device signature byte. 0x4d 0x02 apm value ata device automatic power management value. if an attached ata device supports apm and this field contains other than 0x00, the cy7c68300a will issue a set_features command to enable apm with this value during the drive initialization process. setting apm value to 0x00 disables this functionality. this value is ignored with atapi devices. 0x00 0x03 ata initialization timeout time in 128-ms granularity before the cy7c68300a stops polling the alt stat register for reset complete and restarts the reset process (0x80 = 16.4 seconds). 0x80 0x04 ata command designator value in the first byte of the cbw cb field that designates that the cb is t o be decoded as vendor specific ata commands instead of the atapi command block. see section 4.0 for more detail on how this byte is used. 0x24 0x05 reserved bits(7:4) set to 0 0x07 busy bit delay bit (3) enables a delay of up to 120 ms at each read of the drq bit where the device data length does not match the host data length. this allows the cy7c68300a to work with most devices that incorrectly clear the busy bit before a valid status is present. short packet before stall bit (2) determines if a short packet is sent prior to the stall of an in endpoint. the usb mass storage class bulk-only speci- fication allows a device to send a short or zero-length in packet prior to returning a stall handshake for certain cases. certain host controller drivers may require a short packet prior to stall. 1 = force a short packet before stall. 0 = don?t force a short packet before stall. srst enable bit (1) determines if the cy7c68300a is to do a srst reset during drive initialization. [3] 1 = perform srst during initialization. 0 = don?t perform srst during initialization. skip pin reset bit (0) skip ata_nreset assertion. [4] 0 = allow areset# assertion for all resets. 1 = disable areset# assertion except for power-on reset cycles. notes: 3. at least one reset must be enabled. do not set srst to 0 and skip pin reset to 1at the same time. 4. srst enable must be set in conjunction with skip pin reset. setting this bit causes the cy7c68300a to bypass areset# during i nitialization. all reset events except a power-on reset utilize srst as the drive mechanism.
cy7c68300 a document #: 38-08031 rev. *b page 15 of 26 0x06 ata udma enable bit (7) enable ultra dma data transfer support for atapi devices. if enabled, and if the atapi device reports udma support for the indicated modes, the cy7c68300a will utilize udma data transfers at the highest negotiated rate possible. 0 = disable ata device udma support. 1 = enable ata device udma support. 0xd4 atapi udma enable bit (6) enable ultra dma data transfer support for atapi devices. if enabled, and if the atapi device reports udma support for the indicated modes, the cy7c68300a will utilize udma data transfers at the highest negotiated rate possible. 0 = disable atapi device udma support. 1 = enable atapi device udma support. udma modes bit (5:0) these bits select which udma modes, if supported, are enabled. setting to 1 enables. multiple bits may be set. the cy7c68300a will operate in the highest enabled udma mode supported by the device. the cy7c68300a supports udma modes 2 and 4 only. bit descriptions 5 reserved. must be set to 0. 4 enable udma mode 4. 3 reserved. must be set to 0. 2 enable udma mode 2. 1 reserved. must be set to 0. 0 reserved. must be set to 0. 0x07 reserved pio modes bits(7:2) bits(1:0) these bits select which pio modes, if supported, are enabled. setting to 1 enables. multiple bits may be set. the cy7c68300a will operate in the highest enabled pio mode supported by the device. the cy7c68300a supports pio modes 0, 3, and 4 only. pio mode 0 is always enabled by internal logic. bit descriptions 1 enable pio mode 4. 0 enable pio mode 3. 0x03 0x08 reserved must be set to 0x00. 0x00 0x09 reserved must be set to 0x00. 0x00 0x0a reserved must be set to 0x00. 0x00 0x0b reserved must be set to 0x00. 0x00 0x0c reserved must be set to 0x00. 0x00 0x0d reserved must be set to 0x00. 0x00 0x0e reserved must be set to 0x00. 0x00 0x0f reserved must be set to 0x00. 0x00 device descriptor 0x10 blength length of device descriptor in bytes. 0x12 0x11 bdescriptor type descriptor type. 0x01 0x12 bcdusb (lsb) usb specification release number in bcd. 0x00 0x13 bcdusb (msb) 0x02 0x14 bdeviceclass device class. 0x00 0x15 bdevicesubclass device subclass. 0x00 table 5-6. eeprom organization (continued) eeprom address field name field description required contents suggested contents
cy7c68300 a document #: 38-08031 rev. *b page 16 of 26 0x16 bdeviceprotocol device protocol. 0x00 0x17 bmaxpacketsize0 usb packet size supported for default pipe. 0x40 0x18 idvendor (lsb) vendor id. cypress?s vendor id may only be used for evalu- ation purposes, and not in released products. 0xb4 0x19 idvendor (msb) 0x04 0x1a idproduct (lsb) product id. 0x30 0x1b idproduct (msb) 0x68 0x1c bcddevice (lsb) device release number in bcd lsb (product release number). 0x01 0x1d bcddevice (msb) device release number in bcd msb (silicon release number). 0x00 0x1e imanufacturer index to manufacturer string. this entry must equal half of the address value where the string starts or 0x00 if the string does not exist. 0x38 0x1f iproduct index to product string. this entry must equal half of the address value where the string starts or 0x00 if the string does not exist. 0x4e 0x20 iserialnumber index to serial number string. this entry must equal half of the address value where the string starts or 0x00 if the string does not exist. the usb mass storage class bulk-only transport specification requires a unique serial number (in upper case, hexidecimal characters) for each device. 0x64 0x21 bnumconfigurations number of configurations supported. 0x01 device qualifier 0x22 blength length of device descriptor in bytes. 0x0a 0x23 bdescriptor type descriptor type. 0x06 0x24 bcdusb (lsb) usb specification release number in bcd. 0x00 0x25 bcdusb (msb) usb specification release number in bcd. 0x02 0x26 bdeviceclass device class. 0x00 0x27 bdevicesubclass device subclass. 0x00 0x28 bdeviceprotocol device protocol. 0x00 0x29 bmaxpacketsize0 usb packet size supported for default pipe. 0x40 0x2a bnumconfigurations number of configurations supported. 0x01 0x2b breserved reserved for future use. must be set to zero. 0x00 high-speed configuration descriptor 0x2c blength length of configuration descriptor in bytes. 0x09 0x2d bdescriptortype descriptor type. 0x02 0x2e btotallength (lsb) number of bytes returned in this configuration. this includes the configuration descriptor plus all the interface and endpoint descriptors. 0x20 0x2f btotallength (msb) 0x00 0x30 bnuminterfaces number of interfaces supported. 0x01 0x31 bconfiguration value the value to use as an argument to set configuration to select the configuration. this value must be set to 0x01. 0x01 0x32 iconfiguration index to the configuration string. this entry must equal half of the address value where the string starts or 0x00 if the string does not exist. 0x00 table 5-6. eeprom organization (continued) eeprom address field name field description required contents suggested contents
cy7c68300 a document #: 38-08031 rev. *b page 17 of 26 0x33 bmattributes device attributes for this configuration. bit descriptions 7 reserved. must be set to 1. 6 self-powered. must be set to 1. 5 remote wake-up. must be set to 0. 4?0 reserved. must be set to 0. 0xc0 0x34 bmaxpower maximum power consumption for this configuration. units used are ma*2 (i.e., 0x31 = 98 ma, 0xf9 = 498 ma). 0x00 reported for self-powered devices. 0x00 high-speed interface and endpoint descriptors interface descriptor 0x35 blength length of interface descriptor in bytes. 0x09 0x36 bdescriptortype descriptor type. 0x04 0x37 binterfacenumber interface number. 0x00 0x38 balternatesetting alternate setting. 0x00 0x39 bnumendpoints number of endpoints. 0x02 0x3a binterfaceclass interface class. 0x08 0x3b binterfacesubclass interface subclass. 0x06 0x3c binterfaceprotocol interface protocol. 0x50 0x3d iinterface index to first interface string. this entry must equal half of the address value where the string starts or 0x00 if the string does not exist. 0x00 usb bulk in endpoint 0x3e blength length of this descriptor in bytes. 0x07 0x3f bdescriptortype endpoint descriptor type. 0x05 0x40 bendpointaddress this is an in endpoint, endpoint number 8. 0x88 0x41 bmattributes this is a bulk endpoint. 0x02 0x42 wmaxpacketsize (lsb) max data transfer size. 0x00 0x43 wmaxpacketsize (msb) 0x02 0x44 binterval hs interval for polling (max. nak rate). 0x00 usb bulk out endpoint 0x45 blength length of this descriptor in bytes. 0x07 0x46 bdescriptortype endpoint descriptor type. 0x05 0x47 bendpointaddress this is an out endpoint, endpoint number 2. 0x02 0x48 bmattributes this is a bulk endpoint. 0x02 0x49 wmaxpacketsize (lsb) max data transfer size. 0x00 0x4a wmaxpacketsize (msb) 0x02 0x4b binterval hs interval for polling (max. nak rate). 0x00 full-speed configuration descriptor 0x4c blength length of configuration descriptor in bytes. 0x09 0x4d bdescriptortype descriptor type. 0x02 0x4e btotallength (lsb) number of bytes returned in this configuration. this includes the configuration descriptor plus all the interface and endpoint descriptors. 0x20 0x4f btotallength (msb) 0x00 0x50 bnuminterfaces number of interfaces supported. 0x01 0x51 bconfiguration value the value to use as an argument to set configuration to select the configuration. 0x01 table 5-6. eeprom organization (continued) eeprom address field name field description required contents suggested contents
cy7c68300 a document #: 38-08031 rev. *b page 18 of 26 0x52 iconfiguration index to configuration string. this entry must equal half of the address value where the string starts or 0x00 if the string does not exist. 0x00 0x53 bmattributes device attributes for this configuration. bit descriptions 7 reserved. must be set to 1. 6 self-powered. must be set to 1. 5 remote wake-up. must be set to 0. 4?0 reserved. must be set to 0. 0xc0 0x54 bmaxpower maximum power consumption for the second configuration. units used are ma*2 (i.e., 0x31 = 98 ma, 0xf9 = 498 ma). 0x00 full-speed interface and endpoint descriptors interface descriptor 0x55 blength length of interface descriptor in bytes. 0x09 0x56 bdescriptortype descriptor type. 0x04 0x57 binterfacenumber interface number. 0x00 0x58 balternatesettings alternate settings. 0x00 0x59 bnumendpoints number of endpoints. 0x02 0x5a binterfaceclass interface class. 0x08 0x5b binterfacesubclass interface subclass. 0x06 0x5c binterfaceprotocol interface protocol. 0x50 0x5d iinterface index to first interface string. this entry must equal half of the address value where the string starts or 0x00 if the string does not exist. 0x00 usb bulk inendpoint 0x5e blength length of this descriptor in bytes. 0x07 0x5f bdescriptortype endpoint descriptor type. 0x05 0x60 bendpointaddress this is an in endpoint, endpoint number 8. 0x88 0x61 bmattributes this is a bulk endpoint. 0x02 0x62 wmaxpacketsize (lsb) max data transfer size. 0x40 0x63 wmaxpacketsize (msb) 0x00 0x64 binterval does not apply to fs bulk endpoints. must be set to 0. 0x00 usb bulk out endpoint 0x65 blength length of this descriptor in bytes. 0x07 0x66 bdescriptortype endpoint descriptor type. 0x05 0x67 bendpointaddress this is an out endpoint, endpoint number 2. 0x02 0x68 bmattributes this is a bulk endpoint. 0x02 0x69 wmaxpacketsize (lsb) max data transfer size. 0x40 0x6a wmaxpacketsize (msb) 0x00 0x6b binterval does not apply to fs bulk endpoints. must be set to 0. 0x00 string descriptor examples ( note : the values in these strings are given as examples only and should not be used in final products. designers are encouraged to modify the string values to reflect the final product, since they are what users will see with their operating systems.) usb string descriptor?index 0 (langid) 0x6c blength langid string descriptor length in bytes. 0x04 0x6d bdescriptortype descriptor type. 0x03 table 5-6. eeprom organization (continued) eeprom address field name field description required contents suggested contents
cy7c68300 a document #: 38-08031 rev. *b page 19 of 26 0x6e langid (lsb) language supported. [5] 0x09 0x6f langid (msb) 0x04 usb string descriptor?manufacturer 0x70 blength string descriptor length in bytes (including blength). 0x2c 0x71 bdescriptortype descriptor type. 0x03 0x72 bstring unicode character. ?c? 0x43 0x73 bstring (?nul?) 0x00 0x74 bstring unicode character. ?y? 0x79 0x75 bstring (?nul?) 0x00 0x76 bstring unicode character. ?p? 0x70 0x77 bstring (?nul?) 0x00 0x78 bstring unicode character. ?r? 0x72 0x79 bstring (?nul?) 0x00 0x7a bstring unicode character. ?e? 0x65 0x7b bstring (?nul?) 0x00 0x7c bstring unicode character. ?s? 0x73 0x7d bstring (?nul?) 0x00 0x7e bstring unicode character. ?s? 0x73 0x7f bstring (?nul?) 0x00 0x80 bstring unicode character. ? ? 0x20 0x81 bstring (?nul?) 0x00 0x82 bstring unicode character. ?s? 0x53 0x83 bstring (?nul?) 0x00 0x84 bstring unicode character. ?e? 0x65 0x85 bstring (?nul?) 0x00 0x86 bstring unicode character. ?m? 0x6d 0x87 bstring (?nul?) 0x00 0x88 bstring unicode character. ?i? 0x69 0x89 bstring (?nul?) 0x00 0x8a bstring unicode character. ?c? 0x63 0x8b bstring (?nul?) 0x00 0x8c bstring unicode character. ?o? 0x6f 0x8d bstring (?nul?) 0x00 0x8e bstring unicode character. ?n? 0x6e 0x8f bstring (?nul?) 0x00 0x90 bstring unicode character. ?d? 0x64 0x91 bstring (?nul?) 0x00 0x92 bstring unicode character. ?u? 0x75 0x93 bstring (?nul?) 0x00 0x94 bstring unicode character. ?c? 0x63 0x95 bstring (?nul?) 0x00 0x96 bstring unicode character. ?t? 0x74 0x97 bstring (?nul?) 0x00 note: 5. see http://www.usb.org for langid documentation (the code for english is 0x0409). table 5-6. eeprom organization (continued) eeprom address field name field description required contents suggested contents
cy7c68300 a document #: 38-08031 rev. *b page 20 of 26 0x98 bstring unicode character. ?o? 0x6f 0x99 bstring (?nul?) 0x00 0x9a bstring unicode character. ?r? 0x72 0x9b bstring (?nul?) 0x00 usb string descriptor?product 0x9c blength string descriptor length in bytes (including blength). 0x2c 0x9d bdescriptortype descriptor type. 0x03 0x9e bstring unicode character. ?u? 0x55 0x9f bstring (?nul?) 0x00 0xa0 bstring unicode character. ?s? 0x53 0xa1 bstring (?nul?) 0x00 0xa2 bstring unicode character. ?b? 0x42 0xa3 bstring (?nul?) 0x00 0xa4 bstring unicode character. ?2? 0x32 0xa5 bstring (?nul?) 0x00 0xa6 bstring unicode character. ?.? 0x2e 0xa7 bstring (?nul?) 0x00 0xa8 bstring unicode character. ?0? 0x30 0xa9 bstring (?nul?) 0x00 0xaa bstring unicode character. ? ? 0x20 0xab bstring (?nul?) 0x00 0xac bstring unicode character. ?s? 0x53 0xad bstring (?nul?) 0x00 0xae bstring unicode character. ?t? 0x74 0xaf bstring (?nul?) 0x00 0xb0 bstring unicode character. ?o? 0x6f 0xb1 bstring (?nul?) 0x00 0xb2 bstring unicode character. ?r? 0x72 0xb3 bstring (?nul?) 0x00 0xb4 bstring unicode character. ?a? 0x61 0xb5 bstring (?nul?) 0x00 0xb6 bstring unicode character. ?g? 0x67 0xb7 bstring (?nul?) 0x00 0xb8 bstring unicode character. ?e? 0x65 0xb9 bstring (?nul?) 0x00 0xba bstring unicode character. ? ? 0x20 0xbb bstring (?nul?) 0x00 0xbc bstring unicode character. ?d? 0x44 0xbd bstring (?nul?) 0x00 0xbe bstring unicode character. ?e? 0x65 0xbf bstring (?nul?) 0x00 0xc0 bstring unicode character. ?v? 0x76 0xc1 bstring (?nul?) 0x00 0xc2 bstring unicode character. ?i? 0x69 table 5-6. eeprom organization (continued) eeprom address field name field description required contents suggested contents
cy7c68300 a document #: 38-08031 rev. *b page 21 of 26 0xc3 bstring (?nul?) 0x00 0xc4 bstring unicode character. ?c? 0x63 0xc5 bstring (?nul?) 0x00 0xc6 bstring unicode character. ?e? 0x65 0xc7 bstring (?nul?) 0x00 usb string descriptor?serial number ( note : the usb mass storage class requires a unique serial number in each device. not providing a unique serial number will crash the operating system. the serial number must be at least a minimum size of 12 characters. some hosts will only treat the last 12 characters of the serial number as unique.) 0xc8 blength string descriptor length in bytes (including blength). 0x22 0xc9 bdescriptor type descriptor type. 0x03 0xca bstring unicode character. ?1? 0x31 0xcb bstring (?nul?) 0x00 0xcc bstring unicode character. ?2? 0x32 0xcd bstring (?nul?) 0x00 0xce bstring unicode character. ?3? 0x33 0xcf bstring (?nul?) 0x00 0xd0 bstring unicode character. ?4? 0x34 0xd1 bstring (?nul?) 0x00 0xd2 bstring unicode character. ?5? 0x35 0xd3 bstring (?nul?) 0x00 0xd4 bstring unicode character. ?6? 0x36 0xd5 bstring (?nul?) 0x00 0xd6 bstring unicode character. ?7? 0x37 0xd7 bstring (?nul?) 0x00 0xd8 bstring unicode character. ?8? 0x38 0xd9 bstring (?nul?) 0x00 0xda bstring unicode character. ?9? 0x39 0xdb bstring (?nul?) 0x00 0xdc bstring unicode character. ?0? 0x30 0xdd bstring (?nul?) 0x00 0xde bstring unicode character. ?a? 0x41 0xdf bstring (?nul?) 0x00 0xe0 bstring unicode character. ?b? 0x42 0xe1 bstring (?nul?) 0x00 0xe2 bstring unicode character. ?c? 0x43 0xe3 bstring (?nul?) 0x00 0xe4 bstring unicode character. ?d? 0x44 0xe5 bstring (?nul?) 0x00 0xe6 bstring unicode character. ?e? 0x45 0xe7 bstring (?nul?) 0x00 0xe8 bstring unicode character. ?f? 0x46 0xe9 bstring (?nul?) 0x00 0xea to 0xff unused rom space amount of unused rom space will vary depending on strings. 0xff table 5-6. eeprom organization (continued) eeprom address field name field description required contents suggested contents
cy7c68300 a document #: 38-08031 rev. *b page 22 of 26 6.0 absolute maximum ratings storage temperature ............................................................................................................ ................................?65 c to +150 c ambient temperature with power supplied ........................................................................................ .........................0 c to +70 c supply voltage to ground potential ............................................................................................. ............................ ?0.5v to +4.0v dc input voltage to any input pin .............................................................................................. ........................................... 5.25v dc voltage applied to outputs in high-z state ................................................................................. ............ ?0.5v to v cc + 0.5v power dissipation .............................................................................................................. ................................................ 936 mw static discharge voltage ....................................................................................................... ............................................. > 2000v max output current per io port ................................................................................................. ........................................... 10 ma 7.0 operating conditions [6] t a (ambient temperature under bias) .............................................................................................. .........................0 c to +70 c supply voltage ................................................................................................................. ........................................+3.0v to +3.6v ground voltage ................................................................................................................. .......................................................... 0v f osc (oscillator or crystal frequency) ............................................................................................. ................. 24 mhz 100 ppm ............................................................................................................................... ............................................. parallel resonant 8.0 dc characteristics 9.0 ac electrical characteristics 9.1 usb transceiver complies with the usb 2.0 specification. 9.2 ata timing the ata interface supports ata pio modes 0, 3, and 4, and ultra dma modes 2 and 4 per the ata specification t13/1410d rev. 3b. note: 6. if an alternate clock source is input on xtalin it must be supplied with standard 3.3v signaling characteristics and xtalout must be left floating. parameter description conditions min. typ. max. unit v cc supply voltage 3.0 3.3 3.6 v v ih input high voltage 2 5.25 v v il input low voltage ?0.5 0.8 v i i input leakage current 0 < v in < v cc + 10 a v oh output voltage high i out = 4 ma 2.4 v v ol output voltage low i out = ?4 ma 0.4 v i oh output current high 4ma i ol output current low 4ma c in input pin capacitance all but d+/d- 10 pf only d+/d- 15 pf i cc supply current usb high speed 235 260 ma i cc supply current usb full speed 90 150 ma i susp suspend current connected 250 400 a disconnected 30 180 a t reset reset time after valid power v cc min = 3.0v 1.91 ms
cy7c68300 a document #: 38-08031 rev. *b page 23 of 26 10.0 ordering information 11.0 package diagrams part number package type CY7C68300A-PVC 56 ssop cy7c68300a-lfc 56 qfn cy4615a ez-usb at2 reference design kit figure 11-2. 56-lead quad flatpack no lead (8 x 8 mm) lf56a 0.095 0.025 0.008 seating plane 0.420 0.088 .020 0.292 0.299 0.395 0.092 bsc 0.110 0.016 0.720 0.008 0.0135 0.730 dimensions in inches min. max. 0.040 0.024 0-8 gauge plane .010 1 28 56 29 0.110 0.005 0.010 51-85062-*c figure 11-1. 56-lead shrunk small outline package 056 0.80[0.031] 7.70[0.303] 7.90[0.311] a c 1.00[0.039] max. n seating plane n 2 0.18[0.007] 0.50[0.020] 1 1 0.08[0.003] 0.50[0.020] 0.05[0.002] max. 2 (4x) c 0.24[0.009] 0.20[0.008] ref. 0.80[0.031] max. pin1 id 0-12 6.45[0.254] 8.10[0.319] 7.80[0.307] 6.55[0.258] 0.45[0.018] 0.20[0.008] r. 8.10[0.319] 7.90[0.311] 7.80[0.307] 7.70[0.303] dia. 0.28[0.011] 0.30[0.012] 6.55[0.258] 6.45[0.254] 0.60[0.024] top view bottom view side view e-pad (pad size vary by device type) 51-85144-*d 56-lead qfn 8 x 8 mm lf56a
cy7c68300 a document #: 38-08031 rev. *b page 24 of 26 12.0 pcb layout recommendations the following recommendations should be followed to ensure reliable high-performance operation. at least a four-layer impedance controlled boards are required to maintain signal quality. specify impedance targets (ask your board vendor what they can achieve). to control impedance, maintain trace widths and trace spacing. minimize stubs to minimize reflected signals. connections between the usb connector shell and signal ground must be done near the usb connector. bypass/flyback caps on vbus, near connector, are recommended. dplus and dminus trace lengths should be kept to within 2 mm of each other in length, with preferred length of 20-30mm. maintain a solid ground plane under the dplus and dminus traces. do not allow the plane to be split under these traces. it is preferred is to have no vias placed on the dplus or dminus trace routing. isolate the dplus and dminus traces from all other signal traces by no less than 10 mm. source for recommendations: ez-usb fx2 pcb design recommendations, http:///ww w.cypress.com/cfuploads/support/app_notes/fx2_pcb.pdf. high-speed usb platform design guidelines, http://www.usb.org/developers/data/hs_usb_pdg_r1_0.pdf. 13.0 quad flat package no leads (qfn) package design notes electrical contact of the part to the printed circuit board (pcb) is made by soldering the leads on the bottom surface of the package to the pcb. hence, special attention is required to the heat transfer area below the package to provide a good thermal bond to the circuit board. a copper (cu) fill is to be designed into the pcb as a thermal pad under the package. heat is transf erred from the cy7c68300a through the device?s metal paddle on the bottom side of the package. heat from here is conducted to the pcb at the thermal pad. it is then conducted from the thermal pad to the pcb inner ground plane by a 5 x 5 array of via. a via is a plated through-hole in the pcb with a finished diameter of 13 mil. the qfn?s metal die paddle must be soldered to the pcb? s thermal pad. solder mask is placed on the board top side over each via to resist solder flow into the via. the mask on the top side also minimizes outgassing during the solder reflow process. for further information on this package design please refer to the application note ?surface mount assembly of amkor?s microleadframe (mlf) technology.? this application note can be downloaded from amkor?s website from the following url http://www.amkor.com/products/notes_papers/mlf_appnote_0301.pdf. the application note provides detailed information on board mounting guidelines, soldering flow, rework process, etc. figure 13-1 below display a cross-sectional area underneath the package. the cross section is of only one via. the solder paste template needs to be designed to allow at least 50% solder coverage. the thickness of the solder paste template should be 5 mil. it is recommended that ?no clean,? type 3 solder paste is used for mounting the part. nitrogen purge is recommended during reflow. figure 13-2 is a plot of the solder mask pattern and figure 13-3 displays an x-ray image of the assembly (darker areas indicate solder.) figure 13-1. cross-section of the area underneath the qfn package 0.017? dia solder mask cu fill cu fill pcb material pcb material 0.013? dia via hole for thermally connecting the qfn to the circuit board ground plane. this figure only shows the top three layers of the circuit board: top solder, pcb dielectric, and the ground plane
cy7c68300 a document #: 38-08031 rev. *b page 25 of 26 ? cypress semiconductor corporation, 2003. the information contained herein is subject to change without notice. cypress semico nductor corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a cypress semi conductor product. nor does it convey or imply any license unde r patent or other rights. cypress semiconductor does not authorize its products for use as critical components in life-support syst ems where a malfunction or failure may reasonably be expected t o result in significant injury to the user. the inclusion of cypress semiconductor products in life-support systems application implies th at the manufacturer assumes all risk of such use and in do ing so indemnifies cypress semiconductor against all charges. 14.0 other design considerations certain design considerations must be followed to ensure proper operation of the cy7c68300a. the following items should be taken into account when designing a usb device with the cy7c68300a. 14.1 proper power-up sequence power must be applied to the cy7c68300a before, or at the same time as the ata/atapi device. if power is supplied to the drive first, the cy7c68300a will start up in an undefined state. designs that utilize separate power supplies for the cy7c68300a and the ata/atapi device are not recommended. 14.2 ide removable media devices the cy7c68300a does not fully support ide removable media devices. changes in media state are not reported to the operating system so users will be unable to eject/reinsert media properly. this may result in lost or corrupted data. 14.3 devices with small buffers the size of the ata/atapi device?s buffer can greatly affect the overall data transfer performance. care should be taken to ens ure that devices have large enough buffers to handle the flow of data to/from the drive. the exact buffer size needed depends on a number of variables, but a good rule of thumb is: (aprox min buffer size) = (data rate) * (seek time + rotation time + other) where (other) may include things like time to switch heads, power-up a laser, etc. devices with buffers that are too small to h andle the extra data may perform considerably slower than expected. 15.0 disclaimers, trademarks, and copyrights purchase of i 2 c components from cypress, or one of its sublicensed associated companies, conveys a license under the philips i 2 c patent rights to use these components in an i 2 c system, provided that the system conforms to the i 2 c standard specification as defined by philips. ez-usb at2 is a trademark, and ez-usb is a registered trademark, of cypress semiconductor. all product and company names mentioned in this document are the trademarks of their respective holders. figure 13-2. plot of the solder mask (white area) figure 13-3. x-ray image of the assembly
cy7c68300 a document #: 38-08031 rev. *b page 26 of 26 document history page description title: cy7c68300a ez-usb at2? usb 2.0 to ata/atapi bridge document number: 38-08031 rev. ecn no. issue date orig. of change description of change ** 124022 02/13/03 gir new data sheet *a 124857 06/06/03 gir updated overall language/layout for ?final? status revised description of dplus pin in section 2.2 revised text in sections 2.3.4, 2.3.5, and 2.3.6 updated i susp and t reset values in section 8.0 updated figure 11-2 to include new qfn package drawing number swapped in and out bulk endpoints in section 5.3 *b 129094 08/18/03 gir minor change - rework existing package drawing to improve clarity.

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Price & Availability of CY7C68300A-PVC

	To Download CY7C68300A-PVC Datasheet File
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